Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer

//Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer

We demonstrate the direct transfer of graphene from Cu foil to rigid and flexible substrates, such as glass and PET, using as an intermediate layer a thin film of polyimide (PI) mixed with an aminosilane (3-aminopropyltrimethoxysilane) or only PI, respectively. While the dry removal of graphene by an adhesive has been previously demonstrated—being removed from graphite by scotch tape or from a Cu foil by thick epoxy (~20 µ m) on Si—our work is the first step towards making a substrate ready for device fabrication using the polymer-free technique. Our approach leads to an article that is transparent, thermally stable—up to 350 °C—and free of polymer residues on the device side of the graphene, which is contrary to the case of the standard wet-transfer process using PMMA. Also, in addition to previous novelty, our technique is fast and easier by using current industrial technology—a hot press and a laminator—with Cu recycling by its mechanical peel-off; it provides high inte…

Published in: "2DMaterials".

2018-05-17T12:32:56+00:00 May 17th, 2018|Categories: Publications|Tags: |
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