Precision and chip contamination-free placement of two-dimensional (2D) materials is expected to accelerate both the study of fundamental properties and novel device functionality. Current deterministic transfer methods of 2D materials onto an arbitrary substrate deploy viscoelastic stamping. However, these methods produce (a) significant cross-contamination of the substrate inherent from typical dense sources of 2D material flakes and (b) are challenged with respect to spatial alignment, and (c) multi-transfer at a single step. Here, we demonstrate a novel method of transferring 2D materials resembling the functionality known from printing; utilizing a combination of a sharp micro-stamper and viscoelastic polymer, we show precise placement of individual 2D materials resulting in vanishing cross-contamination to the substrate. Our 2D printer-method results in an aerial cross-contamination improvement of two to three orders of magnitude relative to state-of-the-art transfer metho…

Published in: "2DMaterials".