In article number, Tae‐il Kim and co‐workers present a flexible/stretchable heat sink embedded with boron nitride nanosheets along with tetrahedral interlayer structures. The structured boron nitride layer in the composites induces high thermal conductivity in through‐ as well as in‐plane directions even with a low boron nitride fraction. It is potentially useful in deformable electronics.

Published in: "Advanced Functional Materials".